TIM: Silicone-Free Thermal Interface Material

TIM: With 794TC Auger Valves on E Series Dispensing Thermal Compound Pattern on PCB -Components

E Series: Dispensing Gray Thermal Compound Pattern with 794TC

Thermal Interface Materials (TIM)

Non-silicone thermal compounds are widely used in electronic and electromechanical applications because they offer resistance to thermal cycling degradation. Our thermal compounds are formulated to provide excellent heat transfer, long shelf life stability, and are RoHS and REACH compliant (lead-free).

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Overview

Conventional, silicone-based thermal compound and greases tend to spread after a number of heating and cooling cycles (so called pump-out), creating voids, and losing effectiveness, leading to overheating of electronic components and premature product failure.

Our synthetic-based, silicone-free thermal interface materials resist degradation caused by thermal cycling, which makes them suitable for use in a wide range of electronic and electromechanical applications. Depending on application requirements, users can choose from a wide array of formulas, each with unique features and benefits.

Reference our Thermal Compound Selection Guide below for easy comparison of key characteristics of our most popular formulas. Individual formula data sheets highlight features and benefits along with full technical details.

Common Features

Excellent heat transfer
Non-silicone
Non-hazardous
Will not dry, harden, or melt in normal use
Long shelf-life stability
RoHS and REACH compliant (lead-free)

Specialty Features

High-temperature operation at 250° C continuous
Low/no outgassing for vacuum environments
High dielectric strength
Easy to clean: water while retaining good moisture resistance
Ultra-thin bond line for minimum thermal resistance

Mechanics of Heat Transfer

Choosing the best thermal compound requires some understanding of the mechanics of heat transfer and how the thickness of the thermal compound layer, the bond line thickness, influences product choice.

GV Series: Dispensing TC onto Conveyor Close-up Image

Bond Line Thickness

Bond line can be divided into three categories:

Low, at less than 75 μm
Medium, from 75 to 250 μm
High, at greater than 250 μm

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Conductivity and Resistance

There are two critical thermal performance characteristics: Thermal Conductivity (TC) and Thermal Resistance (TR). In low bond line applications, thermal resistance dominates performance. In high bond line applications, thermal conductivity dominates performance. In medium bond line there is a blended influence.

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Equipment Recommendations

Resources & Downloads

Data Sheets & Guides
Other Resources
Videos

Thermal Compound Selection Guide

Thermal Compound 52022

Thermal Compound 52050

Thermal Compound 52054

Thermal Compound 52055

Thermal Compound 52160

Thermal Compound 53053

Thermal Compound 53054

View Safety Data Sheets

Thermal Compound Dictionary

Request Other Solder Documentation

High-Performance Thermal Interface Material Overview

Our thermal compounds are formulated to provide excellent heat transfer, long shelf life stability, and are RoHS and REACH compliant (lead-free).

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